High Temperature Co-Fired Ceramic (HTCC)
High Temperature Co-Fired Ceramic (HTCC) is an advanced material widely recognized in high-tech industries for its exceptional thermal stability, electrical properties, and structural integrity, making it ideal for hermetic packaging solutions. HTCC packages, such as those produced by AdTech Ceramics, are integral in demanding applications within sectors like aerospace, defense, and medical devices. These packages support high-temperature and high-reliability requirements, providing dense metal interconnects and hermetically sealed vias.
The HTCC fabrication process involves several stages: material preparation, green processing, co-firing, and post-fire processing. During the initial material preparation, raw dielectric materials are milled to create a ceramic "green tape," complemented by conductive inks. In the green processing phase, the ceramic is molded and prepared by cavity punching, via filling, screen printing, and lamination. The final structure undergoes co-firing in a controlled atmosphere, where the ceramic-metal composite is solidified. Subsequent post-fire processes, including additional printing, machining, sawing, and brazing, refine the package. To ensure optimal performance in solder and wire bonding applications, HTCC packages are typically plated with nickel and gold, with both electroless and electrolytic options available.
For technical specifications, design rules, and layout guidelines, refer to GEM Optoeletronics' Design and Capabilities Guideline for HTCC packages.
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It is used in various microwave devices and modules
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High thermal conductivity, small size and high reliability
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Perfect microwave performance
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High thermal conductivity (thermal conductivity ≥ 200W/ m·k)
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Low coefficient of thermal expansion (7.3 ~ 10.5)
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Frequency covers L ~ W band
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It is used in low frequency and high power consumption
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High interconnection density, high integration and small size
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Perfect electrical performance
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High thermal conductivity
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It is used in high frequency and low power consumption
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High interconnection density, high integration and small size 3D interconnection can be realized
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Perfect electrical performance
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High thermal conductivity
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It contains thin film aluminum nitride SIP tube shells and aluminum nitride DPC tube shells.
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Ultra-fine surface processing capacity
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High-density integration
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High thermal conductivity
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It is widely used in ceramic package bases for quartz crystal oscillators, SAW filters, duplexers, and MEMS devices.
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It is widely used in surface-mount package, amplifiers package, drivers package, memories package and comparators package.
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High-density
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High-performance computing
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It is used in standard logic ICs, memory and micro-computer circuits. It is insertable via two rows of pins.
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It is ideal for packaging various VLSI, ASIC circuits
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It is mainly used in GaAs / GaN RF microwave chip packaging
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Excellent RF transmission performance, the frequence covers DC-12GHz, DC-20GHz and also DC-40GHz
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It is mainly used large-scale logic LSI devices
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It is widely used in microprocessors, controllers, ASICs, CUPs, GPUs, and memories required for the new generation of mobile, communication, computing and other intelligent electronic equipment.
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It is widely used in microprocessors, controllers, ASICs, CUPs, GPUs, and memories required for the new generation of mobile, communication, computing and other intelligent electronic equipment.
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It is widely used in infrared body temperature detectors, infrared night vision, security, fire protection, maritime, monitoring applications.
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It can be divided into metal shells with butterfly structure and ceramic shells with butterfly structure and ceramic shells of CLCC, CQFN and CPGA types.
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iIt is used in optical switches and optical isolators.
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The ceramic shell of the hybrid integrated circuit of the optocoupler is commonly packaged with CDIP, CSOP, CLCC, etc.
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The optical communication transceiver component is encapsulated, which can integrate heat sink and sapphire light window to meet the transmission requirements of 25G, 40G, 100G, 800G.
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Optical communication transceiver components, lasers. It can integrate heat sink, fiber optic conduit, light window and other structures.