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DPC components (Direct Plating Copper)

Applications: High-power laser submount, Light obstruction free submount, Heat dissipation                          submount etc.

Technology: Thick Plating  Thin Film

DPC Components

Material: Aluminum Nitride

Size: :4.5 x 5.7 x 0.345  mm

TC ≥170W/m·K, 200W/m·K, 230W/m·K

Submount TTV:≤ 10μm

Ra: 0.3 ~ 0.5μm

Conductive wire area:

Ti( 0.1μm nom)  Cu(2μm nom) Ni(2.5±0.5μm min)  Au(0.5μm min)

Thick film area:

Ti(0.1μm nom)  Cu(75μm nom) Ni(2.5±0.5μm)   Au(1.0μm min)

AuSn area:

Pt(0.2μm min)  AuSn:Au73±3wt%(3.0±0.5μm)  Au Flush(0.1μm Typ)

Aluminum Nitride Components

Material: Aluminum Nitride

Size: :4.5 x 4.0 x 0.337 mm

TC ≥170W/m·K, 200W/m·K, 230W/m·K

Submount TTV:≤ 10μm

Ra: 0.3 ~ 0.5μm

Conductive wire area:

Ti( 0.1μm nom)  Cu(2μm nom) Ni(2.5±0.5μm min)  Au(0.5μm min)

Thick film area:

Ti(0.1μm nom)+Cu(75μm nom)+Ni(2.5±0.5μm)+Au(1.0μm min)

AuSn area:

Pt(0.2μm min)  AuSn:Au73±3wt%(3.0±0.5μm)  Au Flush(0.1μm Typ)

DPC Aluminum Nitride

Material: Aluminum Nitride

Size: :4.5 x 5.2 x 0.345 mm

TC ≥170W/m·K, 200W/m·K, 230W/m·K

Submount TTV:≤ 10μm

Ra: 0.3 ~ 0.5μm

Conductive wire area:

Ti( 0.1μm nom)   Cu(2μm nom) Ni(2.5±0.5μm min)  Au(0.5μm min)

Thick film area:

Ti(0.1μm nom)+Cu(75μm nom)+Ni(2.5±0.5μm)+Au(1.0μm min)

AuSn area:

Pt(0.2μm min)  AuSn:Au73±3wt%(3.0±0.5μm)  Au Flush(0.1μm Typ)

DPC (Direct Plating copper on Aluminum Nitride)

Material: Aluminum Nitride

Size: :4.5 x 6.4 x 0.337 mm

TC ≥170W/m·K, 200W/m·K, 230W/m·K

Submount TTV:≤ 10μm

Ra: 0.3 ~ 0.5μm

Conductive wire area:

Ti( 0.1μm nom   Cu(2μm nom) Ni(2.5±0.5μm min)  Au(0.5μm min)

Thick film area:

Ti(0.1μm nom)+Cu(75μm nom)+Ni(2.5±0.5μm)+Au(1.0μm min)

AuSn area:

Pt(0.2μm min)   AuSn:Au73±3wt%(3.0±0.5μm)   Au Flush(0.1μm Typ)

Direct Plating copper on Aluminum Nitride

Material: Aluminum Nitride

Size: :4.5 x 4.5 x 0.345 mm

TC ≥170W/m·K, 200W/m·K, 230W/m·K

Submount TTV:≤ 10μm

Ra: 0.3 ~ 0.5μm

Conductive wire area:

Ti( 0.1μm nom)   Cu(2μm nom) Ni(2.5±0.5μm min)   Au(0.5μm min)

Thick film area:

Ti(0.1μm nom)   Cu(75μm nom) Ni(2.5±0.5μm)   Au(1.0μm min)

AuSn area:

Pt(0.2μm min)  AuSn:Au73±3wt%(3.0±0.5μm)  Au Flush(0.1μm Typ)

Direct Plating copper on Aluminum Nitride

Material: Aluminum Nitride

Size: :4.75 x 7.9 x 0.345 mm

TC ≥170W/m·K, 200W/m·K, 230W/m·K

Submount TTV:≤ 10μm

Ra: 0.3 ~ 0.5μm

Conductive wire area:

Ti( 0.1μm nom)   Cu(2μm nom) Ni(2.5±0.5μm min)  Au(0.5μm min)

Thick film area:

Ti(0.1μm nom)+Cu(75μm nom)+Ni(2.5±0.5μm)+Au(1.0μm min)

AuSn area:

Pt(0.2μm min)  AuSn:Au73±3wt%(3.0±0.5μm)  Au Flush(0.1μm Typ)

Direct Plating copper on Aluminum Nitride

Material: Aluminum Nitride

Size: :4.5 x 4.5 x 0.345 mm

TC ≥170W/m·K, 200W/m·K, 230W/m·K

Submount TTV:≤ 10μm

Ra: 0.3 ~ 0.5μm

Conductive wire area:

Ti( 0.1μm nom)   Cu(2μm nom) Ni(2.5±0.5μm min)  Au(0.5μm min)

Thick film area:

Ti(0.1μm nom)    Cu(75μm nom) Ni(2.5±0.5μm)  Au(1.0μm min)

AuSn area:

Pt(0.2μm min)   AuSn:Au73±3wt%(3.0±0.5μm)  Au Flush(0.1μm Typ)

Direct Plating copper on Aluminum Nitride

Material: Aluminum Nitride

Size: :4.5 x 2.0 x 0.345 mm

TC ≥170W/m·K, 200W/m·K, 230W/m·K

Submount TTV:≤ 10μm

Ra: 0.3 ~ 0.5μm

Conductive wire area:

Ti( 0.1μm nom)   Cu(2μm nom) Ni(2.5±0.5μm min)  Au(0.5μm min)

Thick film area:

Ti(0.1μm nom)   Cu(75μm nom) Ni(2.5±0.5μm)  Au(1.0μm min)

AuSn area:

Pt(0.2μm min)   AuSn:Au73±3wt%(3.0±0.5μm)  Au Flush(0.1μm Typ)

Direct Plating copper on Aluminum Nitride

Material: Aluminum Nitride

Size: :8.5 x 5.7 x 0.345 mm

TC ≥170W/m·K, 200W/m·K, 230W/m·K

Submount TTV:≤ 10μm

Ra: 0.3 ~ 0.5μm

Conductive wire area:

Ti( 0.1μm nom)   Cu(2μm nom) Ni(2.5±0.5μm min)  Au(0.5μm min)

Thick film area:

Ti(0.1μm nom)   Cu(75μm nom)+Ni(2.5±0.5μm)  Au(1.0μm min)

AuSn area:

Pt(0.2μm min)+AuSn:Au73±3wt%(3.0±0.5μm)+Au Flush(0.1μm Typ)

CONTACT

900E HAMILTON AVE ST 100,

CAMPBELL, CA 95008

sophia@gem-oe.com

+01 (408) 887 7187

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