IC packaging failures and controls. Key modes: wire-bond lift-off, solder-ball voiding/insufficiency, die cracking and interfacial fracture, substrate delamination, and reflow warpage. Mitigations include precision stencil printing, optimized nitrogen/vacuum reflow and ramp rates, improved pastes with lifecycle humidity control, low-CTE substrates/RDL/TSV reinforcement, and inline 3D metrology, X-ray, C-SAM, FEM and AI analytics, achieving void <3%, warpage ≤50 μm, and >99.9%

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