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Ceramic components

Our expansive facilities cover an area exceeding 220,000 square feet, enabling us to accommodate various production needs. With our comprehensive in-house capabilities, we specialize in optical coating, metalization, plating, etching, lithography, wire bonding, and more.

We take pride in delivering reliable mass production quality for a range of ceramic components, including DPC components, HTCC ceramic shell, ceramic submount, high frequency connectors, insulators, Tantalum Capacitors etc. Our expertise allows us to customize ceramic components with design rules to meet our customers' specific requirements. 

To ensure exceptional customer service, our team is available 24/7, including weekends, enabling quick turn-around times and fast order delivery.

dpc components

Material: ALN

Thermal conductivity:170w/(m·k)、200w/(m·k)、230w/(m·k)


Substrate thickness:0.337±0.01μm、0.345±0.01μm  


Graphics spacing:≥100μm


Laser drilling:60-150μm

Thick Cu:80±20μm,Ni:3-5μm,Au≥1μm,Pt:0.25μm min



             Au Flush:0.1μm Typ.

Production capacity: 1000,000 pieces / week


HTCC ceramic subsutrate packaging shell

Material: Alumina (ALN), Alumina white porcelain (AL2O3

                             Alumina black porcelain (AL2O3

Thermal conductivity: ALN > 170,  AL2O3(white) >15,  AL2O3(black) >12 

Internal metallized material: Tungsten

Dimension: 100 x 100mm (Max), thickness 0.3 ~ 4.0 mm

                    thickness of   single layer 0.1 ~ 0.2 mm.

Number of layers: 2 ~ 30 layers

Production capacity: 10,000 pieces / month

ceramic submount

Material: AL2O3 , ALN170w/(m·k) 200w/(m·k) 230w/(m·k)


Thickness:0.127, 0.254, 0.38, 0.5, 0.8, 1.0 mm

Film structure: CrNiAu ,  TiPtAu

Strip width: 15μm (Min.) Space width: 12μm (Min.)

Minimum size: 0.2 mm x 0.2 mm

Production capacity: 200,000 pieces / week

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