High-Performance Submounts
for Optoelectronic & Photonics Packaging
Our expansive facilities cover an area exceeding 220,000 square feet, enabling us to accommodate various production needs. With our comprehensive in-house capabilities, we specialize in optical coating, metalization, plating, etching, lithography, wire bonding, and more.
We deliver reliable, mass-production-quality thin-film submounts and substrates engineered for demanding optoelectronic packaging, photonics packaging, and high-power laser diode applications. With an expansive 220,000 sq. ft. manufacturing facility and comprehensive in-house capabilities, we provide high-precision photolithography, etching, vacuum sputtering, plating, and optical coating services tailored to your exact design rules.
To ensure exceptional customer service, our team is available 24/7, including weekends, enabling quick turn-around times and fast order delivery.
Material: ALN
Thermal conductivity：170w/(m·k)、200w/(m·k)、230w/(m·k)
Substrate thickness：0.337±0.01μm、0.345±0.01μm
Graphics spacing：≥100μm
Laser drilling：60-150μm
Thick Cu：80±20μm，Ni：3-5μm，Au≥1μm，Pt：0.25μm min
AuSn：3.5±0.5μm，Au75±5wt%（5.0±1.0μm），
Au Flush：0.1μm Typ.
Production capacity: 1000,000 pieces / week
Material: CuW (75/25, 80/20, 90/10)
Thickness：as request
Film structure: Ti/Pt/Au, Ni/Ti/Pt/Au, Ni/Ti/Pt/AuSn
Strip width: 15μm (Min.) Space width: 12μm (Min.)
Minimum size: 0.2 mm x 0.2 mm
Production capacity: 200,000 pieces / week
Material: SiC >240w/(m·k)
Thickness：as request
Film structure: Ti/Pt/Au, Pt/AuSn
Strip width: 15μm (Min.) Space width: 12μm (Min.)
Capable of withstanding temperatures up to 425°C for over 15 minutes.
Production capacity: 200,000 pieces / week