The semiconductor industry plays a crucial role in modern technology. From smartphones to computers, semiconductor chips are at the heart...

Featuring ALN, CuW, and Chip Submount Solutions in Semiconductor Packaging Chip bonding is a crucial process in semiconductor packaging. It physically and electrically connects a bare die to the substrate, ensuring optimal performance, thermal management, and reliability. Various bonding techniques are used depending on the packaging application. The selection of materials, such as ALN submounts , CuW submounts , and Diamond submounts , plays a significant role in supporting

XINXIN GEM's Tech: DPC & Custom Ceramics: Aluminum Nitride, Aluminum Oxide

High-Speed Interconnects in AI Networking

Overview Recent advancements in photodetector technology have led to the development of devices capable of capturing multidimensional...

GEM Optics Group LLC has been at the forefront of producing high-volume, cutting-edge IR windows from germanium, Silicon, sapphire, etc.

Generally, tunable lasers and silicon photonic integrated chips are packaged together in a BOX. The box is including flexible plate, ceramic

At OFC 2024, several companies showcased a variety of LPO modules and delivered presentations on this topic at the forum. Lightcounting has provided insights into market trends for high-speed optical modules, and some companies have referenced this data to suggest that LPO modules will become a critical low-power, low-latency option for AI applications in the 800G (and future 1.6T) pluggable optical module market, as well as in the 400G and above AOC market. Below are the dem

Introduction The 140GBd Integrated Coherent Transceiver Optical Sub-Assembly (IC-TROSA) type 2 is a cutting-edge solution in the realm of optical communication. This advanced IC-TROSA is designed to meet the increasing demand for high-capacity, high-speed data transmission, integrating multiple sophisticated components to achieve outstanding performance metrics. Optical module with a transmit power greater than 0dBm Components of IC-TROSA Type 2 The IC-TROSA type 2 comprises

Demo of 1.6T optical module for GAI

The working principle of quantum well infrared detectors is based on subband transitions. After absorbing infrared radiation, the detector excites electrons in the quantum well, causing them to transition from the ground state to the continuum state, thereby achieving infrared detection. According to a report by MMS Consultancy, a recent research team from Shanghai University of Technology and the Shanghai Institute of Technical Physics, Chinese Academy of Sciences, published

The integration of SOA is approached from three aspects: How to increase output power. How to reduce the impact of facet reflection. How to reduce noise and improve signal (eye diagram) modulation quality.

VCSEL, Vertical-Cavity Surface-Emitting Laser, referred to as Vertical Cavity Surface-Emitting Laser, is a semiconductor laser that emits laser light perpendicular to the substrate surface.

Using TriEye's proprietary depth algorithm, SEDAR technology generates point clouds that are calculated pixel by pixel using a pulsed lighting method.

In the past few years, the rapid growth of the information age has captured global attention, particularly regarding the Internet of Things (IoT), artificial intelligence (AI), big data, and cloud computing. Among these technological advancements, smart gas sensors have emerged as a significant interface for human-machine interaction (HMI) and a crucial tool for interacting with the external environment. When using a gas sensor as an HMI interface, it is crucial for it to be

Infrared dual-band photodetector is an important multi-spectral detector, especially in the near infrared/short-wave infrared region, which has stronger penetration ability than visible light, and can identify cold background objects with lower loss than mid-wave infrared, so it is widely used in civil and military fields.

Narrow line-width lasers have extremely high spectral density, extremely low relative intensity noise and phase noise, and ultra-long coherence length.

Let's see the classification of the VCSEL: Edge-Emitting Laser (EEL) and Surface-Emitting Laser(SEL) Edge-Emitting Laser (EEL) and Surface-Emitting Laser(SEL) The low cost of VCSEL is mainly reflected in the fact that the light-emitting area does not need to be directly touched by external technology, and the side emitting side needs to be etched or cleaved, and it needs to be coated. These processes have a huge risk of failure. The second factor is that the GaAs wafer used

With the continuous advancement of modern technology and increasingly fierce market competition, the life cycle of products is becoming...

High performance-oriented infrared refraction lens assembly technology